TPA3116 heat sink, TPA3126 heat sink, TPA3221 heat sink, CS8685 heat sink
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Estimated Delivery Date: Nov 16 - Nov 16
Frequently Asked Questions
Specifications
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TPA3116/3126: The most mainstream and economical solution is to optimize the PCB layout for heat dissipation. If you want to make it into a module, purchase specialized clip on heat sinks.
TPA3221: This is a professional high-power chip, and heat dissipation design is of utmost importance. It must not be taken lightly, and a combination of "PCB copper foil+large external heat sink" must be used.
CS8685: Simple structure, purchase a vertical heat sink suitable for ESOP-16 packaging, apply silicone grease and fasten it.
Finally, a reminder: Regardless of which type of heat sink is used, thermal grease is the key to filling small gaps and improving thermal conductivity efficiency. Please make sure to use it.
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